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Prodigy Logic Module
S2C's FPGA Prototyping system has been in the market since 2004 and has since been widely adopted by many leading SoC/ASIC design companies. The Prodigy Logic Module series are specially designed with low profile and affordability in mind. The Prodigy Logic Modules are based on Xilinx's VU, KU and K7 FPGA devices such as xilinx vu13p.

S2C Prodigy Logic Module Solution

Largest Capacity in Single FPGA

5,541 Logic Cells

2,880 DSP Slices

88.6Mb Internal memories

High System Performance

Up to two speed-grade improvement with high utilization comparing with V7-2000T

On-board support high speed DDR4 & PCIe Gen 3

Accelerated Design Productivity

Co-optimized with Vivado Design Suite for rapid design closure

Prodigy Logic Module Configuration Table
Prodigy Logic Module Configuration Table
7K410 7K325
Estimated ASIC Gates (M) 2.93 2.35
System LC＆LE （K） 407 326
FPGA Internal Memory (Mb) 28 16
DSP Slices 1,540 840
External User I/Os 432 432
SerDes Transceivers 16 16
PCIe Support Gen2 Gen2
DDR4 SO-DIMM -- --
Prodigy Connectors -- --
Datasheet Download Download

Learn more about Prodigy Logic Module
S2C Expands Kintex UltraScale Prototyping Solutions for Consumer-based IoT and Other Small to Medium-Sized Designs
Low cost parallel system integration and software development.

S2C Prodigy FPGA Prototyping Logic Module Addresses Designs with Massive Parallel DSP Algorithms
Prodigy KU is well suited for calculation-intensive applications with the most DSP resources of any other board on the market. The prototyping board also boasts 48 GTH transceivers for high-speed communication throughput. This low cost, all-purpose, stand-alone prototyping system is integrated with S2C's market-leading, vast library of prototyping daughter card to quickly build prototype targets.

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Explore more functional verification methodologies for accelerating chip design at various design stages for various applications.

S2C offers FPGA prototyping solutions for SoC ASIC design and verification, IP/RTL verification and validation to reduce TTM in highly competitive markets